Method for fabricating a semiconductor module having at least one molded silicone sealing

A semiconductor module, comprising:

• a substrate comprising a ceramic layer, a first metallic layer disposed on a first face of the ceramic layer, and a second metallic layer disposed on a second face of the ceramic layer;
• a semiconductor die connected to the first metallic layer of the substrate;
• a cover part;
• a closed sealing ring applied to the cover part, wherein the cover part is mechanically connected to the substrate so that the closed sealing ring is connected with the ceramic layer of the substrate;
• and
• an encapsulant covering the semiconductor die and the substrate.

A method for fabricating a semiconductor module, the method comprising:

• providing a substrate comprising a ceramic layer, a first metallic layer disposed on a first face of the ceramic layer, and a second metallic layer disposed on a second face of the ceramic layer;
• connecting a semiconductor die to the first metallic layer of the substrate;
• applying a cover part to the substrate, the cover part comprising a circumferential vertical section;
• and
• deforming a lower end of the vertical section so that the lower end is pressed inward against the ceramic layer.