Ring structures for integrated circuit packages

A device comprising:

• a package substrate;
• a chip-on-interposer structure on a first side of the package substrate;
• a ball grid array on a second side of the package substrate, wherein the second side of the package substrate is opposite the first side of the package substrate;
• and
• a ring structure on the second side of the package substrate, the ring structure extending around a perimeter of the ball grid array, wherein the ring structure has a first height that is different than a second height of the ball grid array.

A device comprising:

• a chip-on-substrate structure on a first side of a package substrate;
• a first ring structure on the first side of the package substrate, wherein the first ring structure extends around a perimeter of the chip-on-substrate structure;
• a lid on the first ring structure;
• an array of connectors on a second side of the package substrate, wherein the second side of the package substrate is opposite the first side of the package substrate;
• and
• a second ring structure on the second side of the package substrate, the second ring structure extending around a perimeter of the array of connectors.