Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorShohei KASAI
Life of this patent
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Abstract
A semiconductor module, including: a semiconductor element; a wiring board on which the semiconductor element is mounted; a case that has a shape of a frame, to thereby form a housing space to house the semiconductor element and the wiring board; a terminal that is electrically connected to the wiring board; a lid that closes the housing space, the lid including a lid through-hole into which the terminal is inserted; an inner cover disposed in the housing space, the inner cover having an inner through-hole into which the terminal is inserted; and a sealing material disposed between the lid and the inner cover, and sealing the terminal.
Claims10
A semiconductor module, comprising:
- a semiconductor element;
- a wiring board on which the semiconductor element is mounted;
- a case that has a shape of a frame, to thereby form a housing space to house the semiconductor element and the wiring board;
- a terminal that is electrically connected to the wiring board;
- a lid that closes the housing space, the lid including a lid through-hole into which the terminal is inserted;
- an inner cover disposed in the housing space, the inner cover having an inner through-hole into which the terminal is inserted;
- and
- a sealing material disposed between the lid and the inner cover, and sealing the terminal.
Dependencies are inferred from the claim text.