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US 2026/0107822 A1Published application
Package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKo-Chun CHEN, Lu-Ming LAI
Life of this patent
Estimating the term…
Abstract
A package structure is provided. The package structure includes a substrate, a first electronic component, an encapsulant, and a protective element. The first electronic component is over the substrate. The encapsulant is over the substrate and defines a cavity that exposes the first electronic component. The protective element covers the first electronic component. A lateral surface of the protective element is substantially aligned with a lateral surface of the encapsulant.
Claims20
A package structure, comprising:
- a substrate;
- a first electronic component over the substrate;
- an encapsulant over the substrate and defining a cavity exposing the first electronic component;
- and
- a protective element covering the first electronic component, wherein a lateral surface of the protective element is substantially aligned with a lateral surface of the encapsulant.
2 more elements
A package structure, comprising:
- a substrate;
- an encapsulant over the substrate and defining a cavity;
- an electronic component disposed in the cavity;
- and
- a protective element covering the electronic component and at least partially over an upper surface of the encapsulant.
2 more elements
A package structure, comprising:
- a substrate;
- an electronic component over the substrate;
- and
- a pressure-sensitive protective element covering the electronic component, wherein a lateral surface of the pressure-sensitive protective element is substantially aligned with a lateral surface of the substrate.
1 more element
Dependencies are inferred from the claim text.