Manufacture method for a packaging substrate

Abstract

A method of manufacturing a packaging substrate according to the present disclosure comprises a preparation step of preparing a preliminary substrate including a glass core on which a device portion including a device is mounted; and an encapsulation layer forming step of manufacturing the packaging substrate by forming an encapsulation layer surrounding at least a portion of the device portion with an encapsulation layer-forming composition. The glass core comprises a cavity portion that is a space formed by being recessed on an upper surface side of the glass core. The device portion is disposed in the cavity portion. A viscosity of the encapsulation layer-forming composition at 25° C. is 12,000 cps to 38,000 cps. In this case, it is possible to suppress occurrence of voids in the encapsulation layer, and it is possible to suppress occurrence of defects such as the glass core and the encapsulation layer which may occur in the manufacturing process.

Dependencies are inferred from the claim text.