Chip warpage control method in laser compression bonding process

Abstract

The present invention relates to a laser compression bonding process which adsorbs a semiconductor chip (C) with a bonding tool (10) to apply a flux to a bump on the bottom surface of the semiconductor chip (C) in order to minimize the occurrence of problems such as flux application defect, alignment failure, bonding failure, etc. by unfolding the semiconductor chip transformed by preheating with a laser as flat as possible in a process of flux dipping or position alignment or bonding by picking up the semiconductor chip with an adsorption type bonding tool in a laser compression bonding process, and which bonds the semiconductor chip (C) to a substrate (P) by irradiating a laser beam (L) from a laser generator (20) installed in the upper part of the bonding tool (10) while placing and pressing the semiconductor chip on the substrate P after aligning the position with the substrate (P), wherein the laser generator (20) preheats the semiconductor chip (10) at a predetermined temperature in order to restore the semiconductor chip (10) to an original flat state while the bonding tool (10) adsorbs the semiconductor chip (C).

Dependencies are inferred from the claim text.