Wafer level packaging having redistribution layer formed utilizing laser direct structuring

A wafer-level package, comprising:

• an integrated circuit die having a plurality of pads on its front side;
• a resin layer surrounding edge sides of the integrated circuit die, and surrounding the front side of the integrated circuit die;
• wherein the resin layer includes an activatable catalyst material;
• a first passivation layer having its back surface in contact with a front surface of the resin layer adjacent the front side of the integrated circuit die;
• a first solder resist layer having its back surface in contact with a front surface of the first passivation layer;
• and
• a redistribution layer comprising:
• first activated portions of the resin layer adjacent the plurality of pads to form electrical connections extending from the plurality of pads to the back surface of the resin layer;
• second activated portions of the resin layer extending along the back surface of the resin layer toward portions of the resin layer surrounding the edge sides of the integrated circuit die;
• third activated portions of the resin layer extending along the portions of the resin layer surrounding the edge sides of the integrated circuit die;
• and
• a first interconnect structure extending from the second activated portions of the resin layer, through the first passivation layer, and through the first solder resist layer.