Interconnect substrate and method of making the same

Abstract

An interconnect substrate includes a core layer made of glass having one surface and another surface, a first through portion penetrating the core layer from the one surface to the another surface, a resin portion covering an inner wall surface of the first through portion, a first laminate including an interconnect layer and an insulating layer and disposed on the one surface of the core layer, and a second through portion penetrating the first laminate and the core layer, wherein the second through portion extends through an inside of the first through portion, and wherein at a position of penetration through the core layer, an inner wall surface of the second through portion is constituted by the resin portion.

Dependencies are inferred from the claim text.