Direct copper heterogeneous integration

An advanced package assembly, comprising:

• a base structure comprising:
• a core structure comprising a plurality of first vias;
• one or more redistribution layers formed over a surface of the core structure, wherein the one or more redistribution layers comprise redistribution layer vias that are each connected to one or more of the first vias;
• an interconnect panel;
• an outer dielectric layer disposed over the base structure;
• one or more conductor features disposed in one or more gaps of the outer dielectric layer;
• a first electronic component comprising an inorganic material electrically connected to the base structure;
• and
• a second electronic component comprising an organic material electrically connected to the base structure.

A method of forming an advanced package assembly, comprising:

• forming a first base package structure;
• bonding the first base package structure to a first electronic component using at least one copper alloy interconnect, wherein the first electronic component comprises an organic material;
• and
• bonding the first base package structure to a second electronic component using at least one copper alloy interconnect, wherein the second electronic component comprises an inorganic material.