Semiconductor packages with wettable flanks and related methods

A method of providing wettable flanks on leads of a plurality of semiconductor packages, the method comprising:

• providing a leadframe panel comprising a plurality of semiconductor packages, each semiconductor package having a plurality of leads and an exposed flank on at least one lead;
• applying an electrically conductive layer over leadframe panel;
• electroplating each exposed flank to render each exposed flank wettable;
• removing the electrically conductive layer;
• and
• singulating the leadframe panel after removing the electrically conductive layer to singulate the plurality of semiconductor packages.

A method of providing a wettable flank on a lead of a semiconductor package, the method comprising:

• applying an electrically conductive layer over a plurality of leads comprised in a leadframe panel, wherein at least one lead of the plurality of leads has a flank exposed;
• coupling a jig over the plurality of leads, the jig providing an electrical connection to the at least one lead using a pogo pin;
• electroplating the at least one lead to render the flank wettable;
• removing the jig from the plurality of leads;
• and
• singulating the leadframe panel to singulate the semiconductor package.