Electronic component integration method using polymer stamp, electronic component integration device, interposer manufacturing method and interposer

A method for integrating electronic components using a polymer stamp, comprising:

• picking up a first electronic component with a first conductive metal exposed at a lower portion thereof using a polymer stamp;
• positioning the first electronic component on a substrate having a metal wiring at least partially exposed on a surface using the polymer stamp;
• pressing and heating the first conductive metal and the metal wiring using the polymer stamp so that low-temperature bonding occurs between the first conductive metal and the metal wiring;
• and
• separating the first electronic component from the polymer stamp.