US 2026/0107776 A1 · SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Abstract

To improve performance of a semiconductor device. A semiconductor device includes a wiring substrate, a semiconductor chip mounted on a first upper surface of the wiring substrate, an electronic component mounted on the first upper surface, and a stiffener ring fixed to the first upper surface. The stiffener ring includes a first portion arranged to continuously surround a periphery of the semiconductor chip in plan view and adhering to the first upper surface of the wiring substrate, and a second portion connected to the first portion and arranged at a position spaced away from the first upper surface of the wiring substrate in plan view. The second portion of the stiffener ring partially overlaps the electronic component.

Claims16

Dependent claims

A semiconductor device comprising:

a wiring substrate having a first upper surface and a first lower surface opposite the first upper surface;
a semiconductor chip mounted on the first upper surface of the wiring substrate;
an electronic component mounted on the first upper surface of the wiring substrate;
and
a stiffener ring fixed to the first upper surface of the wiring substrate,
wherein the stiffener ring includes:
a first portion arranged to continuously surround a periphery of the semiconductor chip in plan view and adhering to the first upper surface of the wiring substrate, and
a second portion connected to the first portion and arranged at a position spaced away from the first upper surface of the wiring substrate, and
wherein the second portion of the stiffener ring partially overlaps the electronic component.

6 more elements

A method of manufacturing a semiconductor device, comprising:

(a) preparing a wiring substrate including a first upper surface having a plurality of device regions and a dicing region surrounding a periphery of each of the plurality of device regions;
(b) mounting a semiconductor chip on the first upper surface of each of the plurality of device regions;
(c) mounting an electronic component on the first upper surface of each of the plurality of device regions;
and
(d) after the (b) and the (c), mounting a stiffener ring on the first upper surface of each of the plurality of device regions,
wherein the stiffener ring mounted in the (d) has:
a frame shape in plan view and includes a first portion that adheres to the first upper surface in the (d);
and
a second portion connected to the first portion and arranged at a position spaced away from the first upper surface in the (d), and
wherein, in the (d), the stiffener ring is mounted on the first upper surface of each of the plurality of device regions such that the second portion of the stiffener ring partially overlaps the electronic component.

7 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of manufacturing the same

Life of this patent

Semiconductor device and method of manufacturing the same

Life of this patent

Abstract

Claims16