US 2026/0107772 A1 · SEMICONDUCTOR PACKAGE ASSEMBLY WITH DIRECT WATER COOLING SYSTEM

Abstract

A semiconductor package assembly, comprising: a first semiconductor package having at least one first electronic component exposed from its front surface; a second semiconductor package stacked on the first semiconductor package and having at least one second electronic component exposed from its front surface, wherein the first and second semiconductor packages define therebetween a first fluidic channel; and a lid stacked on the second semiconductor package; wherein the lid and the second semiconductor packages define therebetween a second fluidic channel to which the at least one second electronic component is exposed; wherein the second semiconductor package has openings passing therethrough to fluidly connect the first fluidic channel with the second fluidic channel, such that a coolant is capable of flowing within the first and second fluidic channels to dissipate heat generated by electronic components out of the semiconductor package assembly.

Claims20

Dependent claims

A semiconductor package assembly, comprising:

a first semiconductor package having at least one first electronic component exposed from its front surface;
a second semiconductor package stacked on the first semiconductor package and having at least one second electronic component exposed from its front surface, wherein the first and second semiconductor packages define therebetween a first fluidic channel to which the at least one first electronic component is exposed;
and
a lid stacked on and covering the second semiconductor package;
wherein the lid and the second semiconductor packages define therebetween a second fluidic channel to which the at least one second electronic component is exposed;
wherein the second semiconductor package has openings passing therethrough to fluidly connect the first fluidic channel with the second fluidic channel, such that a coolant is capable of flowing within the first and second fluidic channels to dissipate heat generated by the at least one first electronic component and the at least one second electronic component out of the semiconductor package assembly.

3 more elements

A method for forming a semiconductor package assembly, comprising:

providing a first semiconductor package, wherein the first semiconductor package has at least one first electronic component exposed from its front surface;
mounting a second semiconductor package on the first semiconductor package to form a first fluidic channel between the first and second semiconductor packages, wherein the at least one first electronic component is exposed to the first fluid channel, and wherein the second semiconductor package comprises at least one second electronic component exposed from its front surface and openings passing therethrough;
and
stacking a lid on the second semiconductor package to cover the second semiconductor package and form a second fluidic channel between the second semiconductor package and the lid and in fluid connection with the first fluid channel, wherein the at least one second electronic component is exposed to the second fluidic channel.

1 more element

Dependencies are inferred from the claim text.

Semiconductor package assembly with direct water cooling system

Life of this patent

Semiconductor package assembly with direct water cooling system

Life of this patent

Abstract

Claims20