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US 2026/0107770 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsEunbeom Jeon, Sangwoo Park
Life of this patent
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Abstract
A semiconductor package according to an embodiment of the present disclosure includes: a substrate; a semiconductor chip on the substrate and electrically connected to the substrate; at least one heat dissipation wire connected to the semiconductor chip; and an encapsulant on at least a portion of each of the semiconductor chip and the heat dissipation wire. The heat dissipation wire is exposed to one side surface of side surfaces of the encapsulant.
Claims20
A semiconductor package comprising:
- a substrate;
- a semiconductor chip on the substrate and electrically connected to the substrate;
- at least one heat dissipation wire connected to the semiconductor chip;
- and
- an encapsulant on at least a portion of each of the semiconductor chip and the heat dissipation wire,
- wherein the heat dissipation wire is exposed to one side surface of side surfaces of the encapsulant.
3 more elements
A semiconductor package comprising:
- a substrate;
- a plurality of semiconductor chips on the substrate;
- bonding wires electrically connecting each of the plurality of semiconductor chips to the substrate;
- at least one heat dissipation wire connected to at least one of the plurality of semiconductor chips;
- and
- an encapsulant on at least a portion of each of the plurality of semiconductor chips, the bonding wires, and the heat dissipation wire,
- wherein the heat dissipation wire is exposed to one side surface of side surfaces of the encapsulant.
4 more elements
A semiconductor package comprising:
- a substrate;
- a first semiconductor chip on the substrate;
- a second semiconductor chip spaced apart from the first semiconductor chip and on the substrate;
- first bonding wires that electrically connect the first semiconductor chip and the substrate;
- second bonding wires that electrically connect the second semiconductor chip and the substrate;
- a first heat dissipation wire connected to the first semiconductor chip;
- a second heat dissipation wire connected to the second semiconductor chip;
- and
- an encapsulant on at least a portion of each of the first and second semiconductor chips, the first bonding wires, the second bonding wires, the first heat dissipation wire, and the second heat dissipation wire,
- wherein each of the first heat dissipation wire and the second heat dissipation wire is exposed to one side surface of side surfaces of the encapsulant.
7 more elements
Dependencies are inferred from the claim text.