Semiconductor package and method

A method of manufacturing a semiconductor package, the method comprising:

• forming a carrier substrate, forming the carrier substrate comprising:
• depositing a coating portion on a base portion, wherein the coating portion and the base portion comprise different materials, and wherein the base portion has a higher thermal conductivity than the coating portion;
• and
• planarizing a first surface of the coating portion;
• bonding the carrier substrate over a first semiconductor die, wherein the first surface of the coating portion faces the first semiconductor die;
• and
• attaching a lid to the carrier substrate, wherein the carrier substrate is between the first semiconductor die and the lid.

A method of manufacturing a semiconductor package, the method comprising:

• depositing a first coating portion on a first surface of a base portion to form a carrier substrate, wherein the base portion comprises a first material with a first thermal conductivity greater than 170 W/mK;
• bonding the carrier substrate over a first semiconductor die, wherein a first surface of the first coating portion faces the first semiconductor die;
• and
• bonding the first semiconductor die over a package substrate, wherein the first semiconductor die is electrically connected to the package substrate.