Semiconductor device

Abstract

A semiconductor device according to the present disclosure includes: an insulating substrate; a semiconductor element bonded to a surface on one side of the insulating substrate; and a heat sink bonded to a surface on the other side of the insulating substrate, wherein the heat sink has at least one groove in a surface on the other side thereof opposite a surface on the one side thereof to which the insulating substrate is bonded, and the at least one groove is not located in each of portions of the surface on the other side of the heat sink located on opposite sides in a length direction of the at least one groove or in a portion of the surface on the other side of the heat sink located on one side in the length direction of the at least one groove.

Dependencies are inferred from the claim text.