Semiconductor device

Abstract

The present invention relates to a semiconductor device. The semiconductor device of the present invention includes a semiconductor substrate, a semiconductor layer disposed on the semiconductor substrate, a plurality of resistors disposed in the semiconductor layer, at least one electrode layer disposed on the semiconductor layer, and a first temperature measurement pad, a second temperature measurement pad, and a third temperature measurement pad that are disposed on the semiconductor layer, wherein the plurality of resistors are electrically connected to at least one of the first temperature measurement pad, the second temperature measurement pad, and the third temperature measurement pad, and heat is transferred to the plurality of resistors through the semiconductor layer, thereby allowing measurement of temperatures of the semiconductor layer and the highest-temperature heat source of the semiconductor device based on resistance values of the plurality of resistors.

Dependencies are inferred from the claim text.