Semiconductor device with polymer liner and method for fabricating the same

A semiconductor device, comprising:

• a first semiconductor chip comprising a first substrate having a front side and a back side parallel to the front side;
• a bonding dielectric positioned over the front side of the first substrate and a second passivation layer positioned over the back side of the first substrate, wherein the second passivation layer has a top surface facing away from the first substrate;
• a redistribution layer positioned between the bonding dielectric and the front side of the first substrate;
• a first dielectric layer positioned between the front side of the first substrate and the redistribution layer;
• a capping layer positioned between the redistribution layer and the bonding layer;
• a first conductive pad positioned between the capping layer and the bonding layer;
• a second dielectric layer positioned between the capping layer and the bonding layer, wherein a surface of the second dielectric layer is coplanar with a surface of the first conductive pad;
• a conductive feature positioned in the bonding dielectric and the first conductive pad;
• a through substrate via (TSV) exposed through the second passivation layer and electrically coupled to the conductive feature;
• a polymer liner positioned between the TSV and the first substrate;
• a barrier layer positioned between the second passivation layer and the TSV, between the polymer liner and the TSV, and between the conductive feature and the TSV;
• an adhesion layer positioned between the barrier layer and the TSV;
• and
• a second semiconductor chip coupled to the first semiconductor chip at a bonding interface and comprising a second substrate coupled to the first substrate;
• wherein the polymer liner of the first semiconductor chip is separate from the bonding interface;
• wherein the first semiconductor chip further comprises an isolation liner positioned between the barrier layer and the second passivation layer and between the polymer liner and the first substrate.