Semiconductor manufacturing apparatus including stage configured to levitate

A semiconductor manufacturing apparatus comprising:

• a bonding chamber comprising a lower frame and an upper frame provided on the lower frame and having an internal space;
• a lower plate provided on the lower frame, comprising permanent magnets arranged in a matrix, and having a first surface and a second surface opposing the first surface;
• a lower stage configured to levitate above first magnets using magnetic force and comprising at least one electromagnet and a current controller configured to apply current to the at least one electromagnet and control at least one of a direction and an intensity of the current;
• an upper plate having a third surface facing the first surface, the upper plate connected to a lower surface of the upper frame;
• and
• an upper stage provided on the third surface of the upper plate.

A semiconductor manufacturing apparatus comprising:

• a bonding chamber comprising a lower frame and an upper frame provided on the lower frame and having an internal space;
• a lower plate provided on the lower frame, the lower plate comprising electromagnets arranged in a matrix, the lower plate having a first surface and a second surface opposing the first surface;
• a current controller configured to apply current to the electromagnets and to control at least one of a direction and an intensity of the current;
• a lower stage configured to levitate above the electromagnets using magnetic force and comprising at least one permanent magnet;
• an upper plate having a third surface facing the first surface, the upper plate connected to a lower surface of the upper frame;
• and
• an upper stage provided on the third surface of the upper plate.