Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorYukinobu MIYAMOTO
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AssigneeTokyo Electron Limited
InventorYukinobu MIYAMOTO
Estimating the term…
A substrate processing method includes: generating edge information indicating a relationship between a circumferential position around a center of a substrate and an outer edge position of a first film in a radial direction of the substrate based on an image obtained by capturing a peripheral edge region on a front surface of the substrate; setting an exposure map indicating a relationship between the circumferential position and a set value of an exposure width in the radial direction based on the edge information; forming a second film on at least the peripheral edge region of the front surface; obtaining warpage information of the substrate after the second film is formed; setting a relationship between the circumferential position and exposure position information of the substrate in the exposure map based on the warpage information; and exposing the second film in the peripheral edge region in accordance with the exposure map.
A substrate processing method, comprising:
A substrate processing apparatus, comprising:
Dependencies are inferred from the claim text.