Method of manufacturing a semiconductor package, die, and die package

Abstract

A semiconductor package and a method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a deposition process at a temperature below the melting temperature of the auxiliary carrier, keeping a gap between the passivation layers at the side surfaces of adjacent dies of the plurality of dies.

Dependencies are inferred from the claim text.