Substrate trimming apparatus and substrate processing equipment including the same

A substrate processing equipment comprising:

• an index module configured to receive and store a bonding substrate from outside;
• and
• a processing module configured to process the bonding substrate received from the index module,
• wherein the processing module includes:
• a substrate aligning apparatus configured to align the bonding substrate before trimming the bonding substrate;
• a substrate trimming apparatus configured to trim an edge area of the aligned bonding substrate;
• a substrate cleaning apparatus configured to clean the trimmed bonding substrate;
• a substrate drying apparatus configured to dry the cleaned bonding substrate;
• and
• a transfer robot configured to transfer the bonding substrate from a station to another among the substrate aligning apparatus, the substrate trimming apparatus, the substrate cleaning apparatus, and the substrate drying apparatus, and
• the substrate trimming apparatus includes:
• a support configured to support the bonding substrate;
• a waterjet cutting unit arranged to face an upper surface of the support and configured to trim the edge area of the bonding substrate by discharging pressurized fluid;
• a camera unit configured to sense the trimmed edge area of the bonding substrate;
• and
• a suction configured to suck residues generated from the bonding substrate.

A substrate processing equipment comprising:

• an index module including a load chamber storing a bonding substrate received from the outside and a first transfer robot configured to transfer the bonding substrate from the load chamber to a processing module;
• and
• the processing module configured to process the bonding substrate received from the index module,
• wherein the processing module includes:
• a substrate aligning apparatus configured to align the bonding substrate before trimming the bonding substrate and including a stage and a camera;
• a substrate trimming apparatus configured to trim an edge area of the aligned bonding substrate;
• a substrate cleaning apparatus configured to clean the trimmed bonding substrate;
• a substrate drying apparatus configured to dry the cleaned bonding substrate;
• and
• a second transfer robot configured to transfer the bonding substrate from a station to another among the substrate aligning apparatus, the substrate trimming apparatus, the substrate cleaning apparatus, and the substrate drying apparatus,
• the substrate trimming apparatus includes:
• a support configured to support the bonding substrate;
• a waterjet cutting unit arranged to face an upper surface of the support and configured to trim the edge area of the bonding substrate by discharging pressurized fluid;
• a camera unit configured to sense the trimmed edge area of the bonding substrate;
• a suction configured to suck residues generated from the bonding substrate;
• and
• a controller configured to control a position of the waterjet cutting unit, a pressure of the fluid, a type of the fluid, and an operation of the suction based on parameters of the bonding substrate, which are measured by the camera unit, and
• the waterjet cutting unit includes a water body through which ultrapure water passes, an abrasive supplying unit configured to supply an abrasive, an abrasive body storing the abrasive received from the abrasive supplying unit, an orifice through which the ultrapure water passes, a mixing tube in which the ultrapure water and the abrasive are mixed, and a position adjusting unit configured to adjust at least one of a position or an angle of the fluid to be discharged.