Power amplifier device with input-to-output bias-conducting structure and transmitter platform with such a device

A power amplifier device comprising:

• an input side, an output side opposite the input side, and a mounting surface between the input side and the output side, wherein the power amplifier device has an input portion that extends from the input side to a bisection line between the input side and the output side, and an output portion that extends from the output side to the bisection line;
• a first power transistor die coupled to the mounting surface and having an input terminal and an output terminal;
• a first input side signal lead extending from an interior of the power amplifier device beyond the input side, wherein the first input side signal lead is electrically coupled to the input terminal of the first power transistor die;
• a first output side signal lead extending from the interior of the power amplifier device beyond the output side, wherein the first output side signal lead is electrically coupled to the output terminal of the first power transistor die;
• and
• a first input-to-output bias-conducting structure that is not physically directly connected to the first input side signal lead or to the first output side signal lead, and wherein the first input-to-output bias-conducting structure includes
• a first input side bias lead coupled to the input portion of the power amplifier device,
• a first output side bias lead coupled to the output portion of the power amplifier device, and
• a first interior conductive structure having a first end connected to the first input side bias lead, and a second end connected to the first output side bias lead.

A transmitter platform comprising:

• a transmitter substrate with an input side, an output side opposite the input side, and a transmitter substrate mounting surface that extends between the input side of the transmitter substrate and the output side of the transmitter substrate, wherein the transmitter substrate has an input portion that extends from the input side of the transmitter substrate to a bisection line between the input side and the output side, and an output portion that extends from the output side of the transmitter substrate to the bisection line;
• a plurality of input terminals coupled to the input portion of the transmitter substrate, wherein the plurality of input terminals includes a signal input terminal and a bias voltage terminal;
• a power amplifier device coupled to the transmitter substrate mounting surface, wherein the power amplifier device includes
• an input side, an output side opposite the input side, and a device mounting surface between the input side and the output side, wherein the power amplifier device has an input portion that extends from the input side of the power amplifier device to the bisection line, and an output portion that extends from the output side of the power amplifier device to the bisection line,
• a power transistor die coupled to the device mounting surface and having an input terminal and an output terminal,
• an input side signal lead extending from an interior of the power amplifier device beyond the input side of the power amplifier device, wherein the input side signal lead is electrically coupled to the input terminal of the power transistor die,
• an output side signal lead extending from the interior of the power amplifier device beyond the output side of the power amplifier device, wherein the output side signal lead is electrically coupled to the output terminal of the power transistor die, and
• an input-to-output bias-conducting structure that is not physically directly connected to the input side signal lead or to the output side signal lead, and wherein the input-to-output bias-conducting structure includes
• an input side bias lead coupled to the input portion of the power amplifier device,
• an output side bias lead coupled to the output portion of the power amplifier device, and
• an interior conductive structure having a first end connected to the input side bias lead, and a second end connected to the output side bias lead;
• a conductive bias path coupled to the transmitter substrate and extending from the bias voltage terminal to the input side bias lead, wherein the conductive bias path is contained within the input portion of the transmitter substrate and does not extend past the bisection line;
• and
• a conductive signal path coupled to the transmitter substrate and extending from the signal input terminal to the input side signal lead.