Wafer surface cleaning process

Abstract

A method of removing particles from a surface of a wafer, the method including cleaning the wafer with an aqueous first solution. The aqueous first solution including a mixture of a first detergent, a second detergent, and a third detergent. The first detergent including an aqueous solution comprising a pH buffer, an inorganic alkali, a wetting and emulsifying agent, and a chelating agent. The second detergent including an aqueous solution comprising an emulsifier, a pH buffer, an inorganic alkali, a double electric agent, and a chelating agent. The third detergent including an aqueous solution comprising a pH buffer, a wetting and penetration agent, an antistatic and emulsifying agent, and a chelating agent.

Dependencies are inferred from the claim text.