Method for bonding a conductive layer to a substrate

Abstract

A method for bonding a conductive member to a substrate providing a conductive path in aircraft components includes providing a substrate having a top layer with a primary conductive member, providing a secondary conductive member on the top layer, providing a surface structured layer between the primary conductive member and the secondary conductive member, and bonding the secondary conductive member to the top layer by the surface structured layer to conductively couple the primary conductive member and the secondary conductive member. Also disclosed is a conductive component including materially and conductively bonded primary and secondary conductive members.

Dependencies are inferred from the claim text.