Bonding strength inspection apparatus and bonding system
AssigneeSamsung SDI Co., Ltd.
InventorsSang Hyup MOON, Min Jae KIM
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a bonding strength inspection apparatus capable of inspecting a bonding strength of a bonding part without destruct an inspection target. The present disclosure provides a bonding strength inspection apparatus including a roughness measurement part configured to measure a roughness of a bonding part in which a base metal and a bonding member are bonded to each other; and a processor configured to determine a bonding strength of the bonding part based on the roughness.
Claims20
A bonding strength inspection apparatus comprising:
- a roughness measurement part configured to measure a roughness of a bonding part in which a base metal and a bonding member are bonded to each other;
- and
- a processor configured to determine a bonding strength of the bonding part based on the roughness.
A bonding system comprising:
- a bonding apparatus configured to bond a bonding member to a base metal;
- and
- a bonding strength inspection apparatus configured to determine a bonding strength of a bonding part in which the base metal and the bonding member are bonded to each other,
- wherein the bonding strength inspection apparatus comprises a roughness measurement part measuring a roughness of the bonding part, and a processor configured to determine the bonding strength based on the roughness.
A bonding system for a cap assembly comprising:
- a cap-up;
- a vent disposed below the cap-up;
- a cap-down disposed below the vent and having one or more holes exposing at least a portion of the vent downward;
- an insulator disposed between the vent and the cap-down;
- and a sub-plate disposed below the cap-down and coupled to the vent via the one or more holes, the bonding system comprising:
- a bonding apparatus configured to bond the sub-plate and the vent;
- and
- a bonding strength inspection apparatus configured to measure a roughness of a bonding part in which the sub-plate and the vent are bonded and configured to determine a bonding strength of the bonding part based on the roughness.
Dependencies are inferred from the claim text.