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US 2026/0102786 A1Published application
Substrate treatment apparatus and substrate treatment method
AssigneeKioxia Corporation
InventorsYurika KANNO, Hisashi OKUCHI, Yohei YAMAMOTO
Life of this patent
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Abstract
In one embodiment, a substrate treatment apparatus includes a mixer configured to mix a first liquid including a metal element and a second liquid being basicity to generate a third liquid including the metal element and being basicity. The apparatus further includes a supplier configured to supply the third liquid to a substrate. The apparatus further includes a first flow path configured to convey the third liquid from the mixer to the supplier not through a filter that removes particles from the third liquid.
Claims11
1-20. (canceled)
A substrate treatment apparatus comprising:
- a mixer configured to mix a first liquid including a metal element and a second liquid being basicity to generate a third liquid including the metal element and being basicity;
- a supplier configured to supply the third liquid to a substrate;
- and
- a first flow path including a first end that is directly connected to the mixer and a second end that is directly connected to the supplier, the first flow path being configured to convey the third liquid from the mixer to the supplier without filtering the third liquid;
- a collector configured to collect the third liquid having been supplied to the substrate, the collector including a first tank;
- a pre-mixer configured to mix the third liquid from the collector to supply the third liquid to the mixer, the pre-mixer including a second tank;
- a fourth flow path provided with a first filter, and connecting the collector and the pre-mixer;
- and
- a fifth flow path provided with a second filter, and connecting the pre-mixer and the mixer.
6 more elements
Dependencies are inferred from the claim text.