Packaged module having thin substrate

A method for manufacturing a packaged module, the method comprising:

• providing a carrier;
• forming a first-side portion of a dual-sided module on the carrier;
• removing the carrier from the first-side portion to provide a surface;
• providing or forming a packaging substrate on the first-side portion such that the packaging substrate has a thickness less than 200 μm, and such that a first side of the packaging substrate engages the surface of the first-side portion and a second side of the packaging substrate is opposite from the first side;
• and
• forming a second-side portion of the dual-sided module on the second side of the packaging substrate.

A packaged module comprising:

• a packaging substrate having first and second sides with a plurality of layers therebetween in a printed circuit board configuration, and having a thickness that is less than 200 μm;
• a filter die implemented on the first side of the packaging substrate, and a plurality of pins implemented on the second side of the packaging substrate, such that the packaging substrate include a fan out circuit between the filter die and the pins;
• and
• a passive element implemented as part of the packaging substrate and configured to support operation of the filter die.