Semiconductor module

A semiconductor module comprising:

• a first logic chip including a first surface parallel to a first direction and a second direction intersecting the first direction, and a second surface parallel to the first surface;
• a first semiconductor chip including a third surface parallel to the second surface and a fourth surface parallel to the third surface, the third surface being arranged on the second surface, and electrically connected to the first logic chip;
• and
• a first semiconductor cube including a plurality of second semiconductor chips stacked in the first direction, and arranged on the fourth surface, wherein
• each of the plurality of second semiconductor chips includes a first inductor arranged in a third direction perpendicular to the first and second directions,
• the first semiconductor chip includes a plurality of routers and a second inductor arranged parallel to the fourth surface,
• a plurality of circuits in the first logic chip and a plurality of circuits in the first semiconductor chip are connected using the plurality of routers, and
• the plurality of second semiconductor chips, the first logic chip, and the first semiconductor chip are configured to enable contactless communication using the first inductor and the second inductor.