Encapsulated hybrid bonded structures
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsPatrick VARIOT, Belgacem HABA, Hong SHEN, Rajesh KATKAR
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Abstract
An electronic component including a first device die hybrid bonded to a carrier, an encapsulant encapsulating side surfaces of the first device die and a cover element disposed over directly bonded to a top surface of the first device die. The encapsulant comprises particles embedded therein, and wherein an interface between a top surface of the encapsulant and a bottom surface of the cover element lacks ground particles
Claims44
An electronic component comprising:
- a first device die bonded to a carrier;
- a cover element directly bonded to a top surface of the first device die;
- and
- an organic encapsulant encapsulating side surfaces of the first device die, the organic encapsulant extending between the carrier and the cover element,
- wherein a bottom surface of the cover element is adhered to the organic encapsulant.
An electronic component comprising:
- a first device die bonded to a carrier;
- an encapsulant encapsulating side surfaces of the first device die;
- and
- a cover element directly bonded to a top surface of the first device die,
- wherein the encapsulant comprises particles embedded therein, and wherein an interface between a top surface of the encapsulant and a bottom surface of the cover element lacks ground particles.
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An electronic component comprising:
- a first device die directly bonded to a carrier;
- an encapsulant encapsulating side surfaces of the first device die;
- and
- a cover element directly bonded to a top surface of the first device die,
- wherein a top surface of the encapsulant adjacent a bottom surface of the cover element is an unpolished surface.
Dependencies are inferred from the claim text.