Semiconductor device and method for producing semiconductor device

A method for manufacturing a semiconductor device, comprising steps of:

• placing, with respect to a semiconductor element having a first electrode and a second electrode arranged on a first side in a thickness direction, a first bonding layer and a second bonding layer on the first electrode and the second electrode;
• placing a metal clip member having a first conductive portion and a second conductive portion connected to each other on the semiconductor element at the first side in the thickness direction;
• and
• heating and melting the first bonding layer and the second bonding layer while pressing the metal clip member against the semiconductor element toward a second side in the thickness direction, and solidifying them,
• wherein the first conductive portion has a first reverse surface facing the second side in the thickness direction and overlapping the first bonding layer as viewed in the thickness direction,
• the second conductive portion has a second reverse surface facing the second side in the thickness direction and overlapping the second bonding layer as viewed in the thickness direction,
• the second reverse surface is located on the second side in the thickness direction with respect to the first reverse surface, and
• in the step of heating and melting the first bonding layer and the second bonding layer and solidifying them, the metal clip member is pressed toward the second side in the thickness direction until the second reverse surface receives a reaction force from the second electrode.