US 2026/0101782 A1 · SEMICONDUCTOR PACKAGES AND METHODS OF FORMATION

Abstract

A package substrate of a semiconductor package is formed to include bottom conductive pads between package connection pads and conductive structures of the package substrate, where the bottom conductive pads are oblong in a direction along a radial axis through a center of the semiconductor package. The oblong shape and the radial orientation of the bottom conductive pads increase the stiffness of the package substrate, which enables the package substrate to resist deformation that might otherwise occur due to the stresses induced in the package substrate. In this way, the oblong shape and the orientation of the bottom conductive pads reduce the likelihood of cracking and/or delamination in the package substrate that might otherwise be caused by the stresses in the package substrate, which may reduce the likelihood of failure of the semiconductor package and/or may increase the reliability and longevity of the semiconductor package.

Claims20

Dependent claims

A package substrate, comprising:

a substrate core comprising a substrate layer;
a first redistribution structure, on a first side of the substrate layer, comprising:
a first insulator layer;
and
a first plurality of conductive structures in the first insulator layer;
and
a second redistribution structure on a second side of the substrate layer opposing the first side,
wherein the first redistribution structure, the substrate core, and the second redistribution structure are stacked and vertically arranged in the package substrate, and
wherein the second redistribution structure comprises:
a second insulator layer;
and
a second plurality of conductive structures in the second insulator layer;
a layer of bottom conductive pads vertically adjacent to the second plurality of conductive structures;
and
a layer of package connection pads vertically adjacent to the layer of bottom conductive pads,
wherein at least a subset of bottom conductive pads of the layer of bottom conductive pads have a top view shape that is different from a top view shape of the layer of package connection pads.

13 more elements

A semiconductor package, comprising:

a package substrate;
a stiffener structure attached to the package substrate;
and
a semiconductor die package attached to the package substrate and within a perimeter of the stiffener structure,
wherein the package substrate comprises:
a substrate core comprising a substrate layer;
a first redistribution structure on a first side of the substrate layer,
wherein the semiconductor die package is attached to the first redistribution structure;
a second redistribution structure on a second side of the substrate layer opposing the first side,
wherein the first redistribution structure, the substrate core, and the second redistribution structure are stacked and vertically arranged in the semiconductor package, and
wherein the first redistribution structure comprises:
a plurality of vertically-arranged layers of conductive structures;
a layer of bottom conductive pads vertically adjacent to a bottom-most layer of the plurality of vertically-arranged layers of conductive structures;
and
a layer of package connection pads vertically adjacent to the layer of bottom conductive pads,
wherein a subset of bottom conductive pads of the layer of bottom conductive pads, in a region of the package substrate between the stiffener structure and the semiconductor die package, have a top view shape that is different from a top view shape of the layer of package connection pads;
and
package connection structures attached to the layer of package connection pads.

15 more elements

A method, comprising:

forming a first redistribution structure on a first side of a substrate core of a package substrate of a semiconductor package;
forming a plurality of vertically-arranged layers of conductive structures of a second redistribution structure on a second side of the substrate core vertically opposite the first side;
forming a layer of bottom conductive pads over a bottom-most layer of the plurality of vertically-arranged layers of conductive structures,
wherein a subset of bottom conductive pads of the layer of bottom conductive pads have a top view shape that is elongated in a direction along radii of the package substrate through approximate centers of the subset of bottom conductive pads;
forming a layer of package connection pads over the layer of bottom conductive pads;
and
attaching package connection structures to the layer of package connection pads.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor packages and methods of formation

Life of this patent

Semiconductor packages and methods of formation

Life of this patent

Abstract

Claims20