Interconnect bridge

A method comprising:

• electrically coupling through-layer interconnects of an interconnect bridge to a patterned metal layer, the interconnect bridge comprising:
• a metal-dielectric composite structure comprising first dielectric layers and first metal layers patterned and interconnected to define first conductive paths;
• an organic structural layer coupled to the metal-dielectric composite structure;
• and
• the through-layer interconnects that extend through the organic structural layer and are electrically coupled to the first metal layers;
• and
• forming additional layers on the patterned metal layer and the interconnect bridge to form a substrate comprising second dielectric layers and second metal layers patterned and interconnected to define second conductive paths, wherein the interconnect bridge is embedded within the substrate.

An integrated device comprising:

• an interconnect bridge comprising:
• a metal-dielectric composite structure comprising first dielectric layers and first metal layers patterned and interconnected to define contacts and first conductive paths;
• an organic structural layer coupled to the metal-dielectric composite structure;
• and
• through-layer interconnects that extend through the organic structural layer and are electrically coupled to the first metal layers;
• a substrate comprising second dielectric layers and second metal layers patterned and interconnected to define second conductive paths, wherein the interconnect bridge is embedded within the substrate, and wherein the first conductive paths of the metal-dielectric composite structure are electrically coupled to the second metal layers through the contacts and the through-layer interconnects of the interconnect bridge;
• a first die coupled to the substrate;
• and
• a second die coupled to the substrate and electrically coupled to the first die through the first conductive paths.