Semiconductor package

A semiconductor package, comprising:

• a first substrate including a first redistribution circuit;
• a second substrate on the first substrate and including a second redistribution circuit;
• at least one chip structure on the second substrate and including connection pads;
• first bump structures between the first substrate and the second substrate and electrically connecting the first redistribution circuit to the second redistribution circuit;
• and
• second bump structures between the at least one chip structure and the second substrate and electrically connecting the second redistribution circuit to the connection pads,
• wherein each of at least some of the first bump structures and each of at least some of the second bump structures includes
• a pillar bump,
• a solder ball on a lower surface of the pillar bump,
• and a barrier film on a side surface of the pillar bump,
• wherein the side surface of the pillar bump includes an upper side surface and a lower side surface, the upper side surface in contact with the barrier film, the lower side surface exposed from the barrier film, and
• wherein the solder ball is in contact with the lower surface of the pillar bump and with the lower side surface of the pillar bump.

A semiconductor package, comprising:

• a first substrate including a first redistribution circuit;
• a second substrate on the first substrate and including a second redistribution circuit;
• at least one chip structure on the second substrate and including connection pads;
• first bump structures between the first substrate and the second substrate and electrically connecting the first redistribution circuit to the second redistribution circuit;
• and
• second bump structures between the at least one chip structure and the second substrate and electrically connecting the second redistribution circuit to the connection pads,
• wherein each of at least some of the first bump structures and each of at least some of the second bump structures includes
• a pillar bump,
• a solder ball at least partially covering a lower surface of the pillar bump,
• and a barrier film at least partially covering a side surface of the pillar bump,
• wherein the barrier film includes a first portion and a second portion, the first portion having a first side surface extending along the side surface of the pillar bump, the second portion having a second side surface extending from the first side surface to the side surface of the pillar bump, and
• wherein a slope of the second side surface with respect to the side surface of the pillar bump decreases towards the solder ball.