Semiconductor device and manufacturing method thereof

A semiconductor device, comprising:

• a substrate that has a first face and a second face on a side opposite to that of the first face;
• a plurality of first semiconductor chips mounted on the first face of the substrate and arranged on a first side of a center line that extends in a first direction through a center of the first face, wherein at least two of the first semiconductor chips are aligned in a second direction that is perpendicular to the first direction;
• a plurality of second semiconductor chips mounted on the first face of the substrate and arranged on a second side of the center line, wherein at least two of the second semiconductor chips are aligned in the second direction;
• a first non-semiconductor part mounted on the first face of the substrate on the first side of the center line and extending in the second direction;
• and
• a second non-semiconductor part mounted on the first face of the substrate on the second side of the center line and extending in the second direction,
• wherein a linear expansion coefficient of the first non-semiconductor part and a linear expansion coefficient of the second non-semiconductor part are each greater than a linear expansion coefficient of the substrate, and the linear expansion coefficient of the substrate is greater than a linear expansion coefficient of each of the first and second semiconductor chips.

A semiconductor device manufacturing method, comprising:

• mounting at least one semiconductor part on a first face of a substrate;
• and
• mounting a non-semiconductor part on the first face of the substrate,
• wherein a linear expansion coefficient of the non-semiconductor part is greater than a linear expansion coefficient of the substrate, and the linear expansion coefficient of the substrate is greater than a linear expansion coefficient of the at least one semiconductor part.