US 2026/0101771 A1 · SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Abstract

A semiconductor device having an improved bonding reliability of wire bonding is provided. The semiconductor device includes a semiconductor chip, a die pad, an inner lead, and a bonding wire. The semiconductor chip has a first lower surface, and a bonding pad provided on a first upper surface. The bonding pad has a second upper surface. The die pad has a third upper surface. The inner lead has a fourth upper surface. The semiconductor chip is mounted on the die pad such that the first lower surface faces the third upper surface. The bonding pad and the inner lead are electrically connected to each other via the bonding wire. In cross-sectional view, the second upper surface, to which the bonding wire is connected, of the bonding pad is located at the same height as the fourth upper surface, to which the bonding wire is connected, of the inner lead.

Claims13

Dependent claims

A semiconductor device comprising:

a semiconductor chip;
a die pad;
a lead;
and
a bonding wire,
wherein the semiconductor chip has a first lower surface and a first upper surface opposite the first lower surface,
wherein the semiconductor chip has a bonding pad provided on the first upper surface,
wherein the bonding pad has a second upper surface,
wherein the die pad has a third upper surface,
wherein the lead has an outer lead and an inner lead,
wherein the inner lead has a fourth upper surface,
wherein the inner lead is connected to the outer lead,
wherein the semiconductor chip is mounted on the die pad such that the first lower surface faces the third upper surface,
wherein the bonding pad and the inner lead are electrically connected to each other via the bonding wire, and
wherein, in cross-sectional view, the second upper surface, to which the bonding wire is connected, of the bonding pad is located at the same height as the fourth upper surface, to which the bonding wire is connected, of the inner lead.

12 more elements

A method of manufacturing a semiconductor device, comprising steps of:

(a) preparing a semiconductor chip having:
a first lower surface, a first upper surface opposite the first lower surface, and a bonding pad having a second upper surface and provided on the first upper surface;
(b) preparing a lead frame including:
a die pad having a third upper surface, and a lead including an inner lead having a fourth upper surface;
(c) mounting the semiconductor chip on the die pad such that the first lower surface faces the third upper surface;
and
(d) electrically connecting the bonding pad and the inner lead to each other via a bonding wire by using a bonding apparatus,
wherein the bonding apparatus includes:
a bonding head;
a stage that is capable to move the bonding head in a horizontal plane;
a transducer having a first end portion and a second end portion, the first end portion being connected to the bonding head;
and
a capillary connected to the second end portion of the transducer and holding the bonding wire,
wherein the bonding wire has one end portion and an other end portion,
wherein the step of (d) includes:
(d1) connecting the one end portion of the bonding wire to the second upper surface of the bonding pad,
(d2) after the (d1), moving the bonding head until the other end portion of the bonding wire is located on the fourth upper surface of the inner lead, while the second end portion of the transducer is moved in an arc motion such that an extending direction of the capillary is inclined with respect to a normal direction of the horizontal plane, and
(d3) after the (d2), connecting the other end portion of the bonding wire to the fourth upper surface of the inner lead, and
wherein the extending direction of the capillary is parallel to the normal direction when the one end portion of the bonding wire is connected to the second upper surface of the bonding pad and when the other end portion of the bonding wire is connected to the fourth upper surface of the inner lead.

16 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of manufacturing the same

Life of this patent

Semiconductor device and method of manufacturing the same

Life of this patent

Abstract

Claims13