Package structure

A package structure, comprising:

• a substrate comprising a ground element at an upper surface of the substrate;
• an encapsulant disposed on the upper surface of the substrate and exposing the ground element;
• an electronic component disposed on the upper surface of the substrate exposed by the encapsulant, wherein the ground element is between the encapsulant and the electronic component;
• a connection element disposed in a gap between the electronic component and the substrate and configured to electrically connecting the electronic component to the substrate;
• and
• a dielectric layer encapsulating the connection element and spaced apart from the ground element, wherein the gap is not entirely filled by the dielectric layer.

A package structure, comprising:

• a substrate;
• a plurality of first electronic components over the substrate;
• a first encapsulant encapsulating the first electronic components;
• a plurality of second electronic components over the substrate and exposed by the first encapsulant;
• and
• a first shielding layer adhered to an outer lateral surface of the first encapsulant and configured to accommodate the second electronic components.