Semiconductor package, semiconductor package manufacturing method, and semiconductor package manufacturing device
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeonrae Cho, Gongmyeong Kim, Chaein Moon, Taejae Park
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Abstract
A semiconductor package includes a substrate including a first layer, a plurality of structures extending in a first direction on the first layer by a first length and including the same materials as the first layer, and a first semiconductor chip bonded to the substrate, wherein a separation distance in the first direction between a first surface of the first semiconductor chip facing the substrate and the substrate is determined by the first length.
Claims20
A semiconductor package, comprising:
- a substrate including a first layer;
- a plurality of structures, wherein the plurality of structures protrude from the first layer in a first direction by a first length and include a same material as the first layer;
- and
- a first semiconductor chip bonded to the substrate,
- wherein (i) a first surface of the first semiconductor chip and (ii) the substrate are separated from one another in the first direction by a separation distance, and the separation distance is determined based on the first length.
A semiconductor package manufacturing method, comprising:
- forming a structure that protrudes from a substrate in a first direction;
- heating a solder that electrically connects a semiconductor chip and the substrate, wherein the semiconductor chip is spaced apart from the substrate in the first direction;
- and
- applying a pressure to the semiconductor chip in a direction opposite to the first direction,
- wherein a first surface of the semiconductor chip contacts the structure, wherein the structure includes a solder resist, and wherein the first surface faces the substrate.
A semiconductor package manufacturing device, comprising:
- a first jig disposed on a stage and in contact with a first surface of a substrate;
- a second jig in contact with a second surface of the substrate, wherein the second surface is opposite to the first surface;
- a heater configured to heat a solder that electrically connects the substrate with a semiconductor chip bonded to the substrate, wherein the substrate and the semiconductor chip are spaced apart in a first direction;
- and
- a compressor configured to pressurize a fourth surface of the semiconductor chip, wherein the fourth surface is opposite to a third surface of the semiconductor chip, and wherein the third surface faces the substrate,
- wherein a length of the second jig in the first direction is equal to a sum of a gap between the substrate and the semiconductor chip in the first direction and a thickness of the semiconductor chip in the first direction.
Dependencies are inferred from the claim text.