Heat dissipation through redistribution structure

A semiconductor package structure, comprising:

• a package substrate;
• an interposer bonded to the package substrate and comprising:
• a redistribution structure, and
• a seal ring structure extending around the redistribution structure;
• and
• an integrated circuit (IC) die bonded to the interposer by way of a plurality of first type solder features,
• wherein at least one of the plurality of first type solder features is electrically coupled to the seal ring structure.

A semiconductor package structure, comprising:

• a package substrate;
• an interposer bonded to the package substrate and comprising:
• a redistribution structure, and
• a seal ring structure extending around the redistribution structure;
• and
• an integrated circuit (IC) die comprising a plurality of transistors and bonded to the interposer by way of a plurality of contact features,
• wherein the plurality of contact features comprises a first subset of contact features and a second subset of contact features,
• wherein the first subset of contact features are electrically coupled to the plurality of transistors,
• wherein the second subset of contact features are electrically isolated from the plurality of transistors,
• wherein the second subset of contact features are electrically coupled to the seal ring structure.