Semiconductor package with bump structure

A semiconductor package comprising:

• a base structure;
• a bump connected to the base structure;
• and
• a chip connected to the bump,
• wherein the chip comprises:
• a substrate,
• an insulating structure between the substrate and the bump,
• a protective layer between the bump and the insulating structure,
• a conductive pad between the protective layer and the insulating structure, and
• a connection pattern penetrating the protective layer and connecting the bump and the conductive pad,
• wherein the protective layer comprises a first portion, and a second portion and a third portion spaced apart from each other with the first portion therebetween,
• wherein a surface of the first portion of the protective layer is in contact with a surface of the insulating structure,
• wherein a surface of the third portion of the protective layer is in contact with a surface of the conductive pad, and
• wherein a surface of the second portion of the protective layer is spaced apart from the insulating structure and the conductive pad.

A semiconductor package comprising:

• a base structure;
• a bump connected to the base structure;
• a chip connected to the bump;
• and
• a filling layer surrounding the bump,
• wherein the chip comprises:
• a substrate,
• an insulating structure between the substrate and the bump,
• a semiconductor device between the substrate and the insulating structure,
• a conductive via connected to the semiconductor device,
• a conductive pad in contact with the conductive via,
• a protective layer in contact with the insulating structure and the conductive pad, and
• a connection pattern penetrating the protective layer and in contact with the bump and the conductive pad,
• wherein the protective layer comprises a first portion in contact with a surface of the insulating structure and a second portion spaced apart from the insulating structure, and
• wherein the filling layer comprises:
• a first interposed portion in contact with a surface of the second portion of the protective layer, and
• a first connection portion in contact with a sidewall of the second portion of the protective layer.