US 2026/0101739 A1 · DEVICE PACKAGE

Abstract

A device package includes a first tier, a second tier stacked upon the first tier, and a through tier via unitarily penetrating through the first and second tiers. The first tier includes a first device and a first interconnect structure electrically coupled to the first device, the first interconnect structure includes a first metal layer, and the first metal layer includes a first connection branch. The second tier includes a second device and a second interconnect structure electrically coupled to the second device, the second interconnect structure includes a second metal layer, and the second metal layer includes a second connection branch. The through tier via is electrically coupled to the first and second connection branches.

Claims20

Dependent claims

A device package, comprising:

a first tier, comprising a first device and a first interconnect structure electrically coupled to the first device, the first interconnect structure comprising a first metal layer, and the first metal layer comprising a first connection branch;
a second tier, stacked upon the first tier, comprising a second device and a second interconnect structure electrically coupled to the second device, the second interconnect structure comprising a second metal layer, and the second metal layer comprising a second connection branch;
and
a through tier via, unitarily penetrating through the first tier and the second tier, electrically coupled to the first connection branch and the second connection branch.

1 more element

Dependencies are inferred from the claim text.

Device package

Life of this patent

Device package

Life of this patent

Abstract

Claims20