Interactive user interface for substrate edge profile
AssigneeApplied Materials, Inc.
InventorsChen Chen, Michael Koltonski, Zhaozhao Zhu
Life of this patent
Estimating the term…
Abstract
A method for calibrating an edge ring height is described herein. The method includes measuring first thicknesses at a plurality of locations of a substrate using a substrate measurement system of a substrate processing system, and performing a process on the substrate in a process chamber including an edge ring that surrounds the substrate. The method also includes measuring second thicknesses the plurality of locations and estimating a rate and edge ring height of the edge ring and calibrating the edge ring height based on the estimated edge ring height.
Claims17
A method comprising:
- obtaining first thicknesses at a plurality of locations of a substrate;
- performing a process on the substrate in a process chamber, wherein the process chamber comprising an edge ring that surrounds the substrate;
- measuring, after performing the process, second thicknesses at the plurality of locations of the substrate using a substrate measurement system of the substrate process system;
- estimating an etch rate, a deposition rate, or a treatment rate at an edge of the substrate based on the first thicknesses and the second thicknesses;
- estimating an edge ring height of the edge ring based on the etch rate, the deposition rate, or the treatment rate;
- and
- calibrating the edge ring height based on the estimated edge ring height comprising:
- determining a difference between the estimated edge ring height and a target edge ring height;
- and
- adjusting the edge ring height of the edge ring based on the determined difference.
A method comprising:
- receiving data comprising a plurality of data entries, each data entry of the plurality of data entries comprising a pre-etch thickness profile of a substrate, a post-etch thickness profile of the substrate, and an edge ring height associated with an etch process performed on the substrate;
- processing the plurality of data entries to determine, for each data entry of the plurality of data entries, a normalized etch rate at an edge of the substrate;
- determining a mathematical model that relates edge ring height to the normalized etch rate at the edge of the substrate based on the data, wherein the mathematical model is usable to calibrate the edge ring height for one or more process chambers.
A system comprising:
- a process chamber that is configured to perform an etch process;
- one or more robots, to move the substrate from the process chamber to a substrate measurement system;
- the substrate measurement system configured to measure a thickness of the substrate and to generate a profile map of the substrate;
- and
- a computing device, to:
- process data from the profile map using a trained mathematical model, wherein the trained mathematical model outputs an estimated etch rate for the substrate.
Dependencies are inferred from the claim text.