Chip plcaing apparatus, processing system and processing method
AssigneeTokyo Electron Limited
InventorTetsuo FUKUOKA
Life of this patent
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Abstract
A processing method of processing multiple chips using an electrostatic carrier, which includes a main body having conductivity and provided with multiple through holes in a thickness direction thereof; and an insulating layer formed on a front surface of the main body, includes arranging and placing the multiple chips on a holding surface of the electrostatic carrier; supplying power to the main body to electrically charge the main body; and bringing an earth wire into contact with the chip to generate an electrostatic force between the chip and the main body.
Claims20
A chip placing apparatus, comprising:
- a chip transfer mechanism configured to pick up a chip and place the chip on an attraction surface of a chip transfer carrier,
- wherein the chip transfer carrier comprises:
- a main body having multiple through holes formed in a thickness direction thereof;
- and
- a film formed on a front surface of the main body to cover the multiple through holes, and
- wherein the chip transfer mechanism is configured to discharge air from between the film of the chip transfer carrier and the chip when the chip is placed on the chip transfer carrier, thereby generate a vacuum attracting force between the chip transfer carrier and the chip.
A chip placing apparatus configured to pick up a chip and place the chip on an attraction surface of a chip transfer carrier,
- wherein the chip transfer carrier is an electrostatic carrier comprising:
- a main body having conductivity and provided with multiple through holes in a thickness direction thereof;
- and
- a film having insulation property, which is formed on a front surface of the main body to cover the multiple through holes, wherein the chip placing apparatus comprises:
- a carrier holder having a holding surface for the electrostatic carrier on a top surface thereof;
- a power supply configured to supply power to the main body of the electrostatic carrier on the carrier holder;
- and
- a charge eliminator configured to come into contact with the chip on the electrostatic carrier to take earth, and
- wherein the charge eliminator has an earth wire to be brought into contact with the chip, so as to face the holding surface for the electrostatic carrier on the carrier holder.
Dependencies are inferred from the claim text.