Stacking structure and manufacturing method thereof

A structure, comprising:

• a first bonding structure;
• a first die disposed on a first side of the first bonding structure, wherein the first die includes a second bonding structure;
• a first encapsulation material wrapping around the first die;
• a second die disposed on a second side of the first bonding structure opposite to the first side, wherein the second die includes a third bonding structure and through die vias;
• and
• a second encapsulation material wrapping around the second die,
• wherein the second bonding structure of the first die is bonded with the first bonding structure, and the third bonding structure of the second die is bonded with the first bonding structure located between the first and second dies and the first and second encapsulation materials.

A method, comprising:

• forming a first bonding structure with electrically floating marks;
• providing first dies, each first die having a second bonding structure;
• disposing the first dies and aligning the first dies over a first side of the first bonding structure using the electrically floating marks as alignment marks;
• bonding the first dies with the first bonding structure, each second bonding structure is bonded with the first bonding structure;
• forming a first encapsulation material over the first dies and covering the first die to form a first wafer structure;
• providing second dies, each second die having a third bonding structure;
• disposing the second dies and aligning the second dies over a second side of the first bonding structure opposite to the first side using the electrically floating marks as the alignment marks;
• bonding the second dies with the first bonding structure, each third bonding structure is bonded with the first bonding structure;
• and
• forming a second encapsulation material over the second dies and at least laterally wrapping around the second dies to form a second wafer structure.