A substrate processing apparatus configured to perform a batch process in which a plurality of substrates are processed as a batch, and a single-wafer process in which one substrate is processed at a time, continuously, the substrate processing apparatus comprising:
- a stocker block;
- a transfer block that is positioned adjacently to the stocker block;
- a processing block that is positioned adjacently to the transfer block;
- and
- a substrate placing unit where a plurality of substrates in a horizontal orientation are placed along a vertical direction at a predetermined interval between the plurality of substrates, wherein
- the stocker block that accommodates at least one carrier storing a plurality of substrates in the horizontal orientation at the predetermined interval between the plurality of substrates in a vertical direction, and includes at least one carrier placing shelf for taking out and storing a substrate, the carrier placing shelf on which the carrier is placed so as to enable a substrate to be taken out from or to be delivered to the carrier,
- the transfer block includes:
- a substrate handling mechanism that takes out or stores a plurality of substrates from and into the carrier placed in the carrier placing shelf, as a batch;
- and
- a first orientation converting mechanism that converts the plurality of substrates in the horizontal orientation to a vertical orientation,
- the processing block includes:
- a batch processing area extending in a direction separating from the transfer block;
- a single-wafer processing area having one end at a position near the transfer block and another end extending in the direction separating from the transfer block;
- a single-wafer transporting area interposed between the batch processing area and the single-wafer processing area, and having one end positioned adjacently to the transfer block and another end extending in the direction separating from the transfer block;
- and
- a batch substrate transporting area provided along the batch processing area, and having one end extending to the transfer block and another end extending in the direction separating from the transfer block,
- the batch processing area is provided with a plurality of batch processing baths that are configured to immerse a plurality of substrate as a batch, and that are arranged along a direction in which the batch processing area extends;
- and a second orientation converting mechanism that is configured to convert the plurality of substrates from the vertical orientation to the horizontal orientation,
- the single-wafer processing area is provided with a single-wafer processing chamber configured to process one substrate at a time, along the direction in which the single-wafer processing area extends,
- the single-wafer transporting area is provided with a single-wafer transporting mechanism that is configured to transport a substrate to and from the second orientation converting mechanism, the single-wafer processing chamber, and the substrate placing unit,
- the batch substrate transporting area is provided with a batch substrate transporting mechanism configured to transport a plurality of substrates to and from a substrate delivery position defined in the transfer block, the plurality of batch processing baths, and the second orientation converting mechanism, as a batch, and
- the substrate handling mechanism in the transfer block is configured to transport a plurality of substrates to the first orientation converting mechanism, as a batch, and transport a plurality of substrates from the substrate placing unit, as a batch.