Light emitting device and method of manufacturing light emitting device

A light emitting device comprising:

• a semiconductor light emitting element;
• and
• a package that seals the semiconductor light emitting element, wherein:
• the package includes a base and a cover bonded to the base, the base having:
• a first upper surface region directly or indirectly supporting the semiconductor light emitting element;
• and
• a second upper surface region surrounding the first upper surface region in a plan view as viewed in a direction normal to the first upper surface region;
• the second upper surface region is positioned above the first upper surface region;
• the base of the package includes one or more base-side metal layers positioned on the second upper surface region of the base;
• the cover of the package includes one or more cover-side metal layers positioned in a portion that opposes the one or more base-side metal layers of a lower surface region opposing the first upper surface region and the second upper surface region;
• in the plan view, an outermost edge of the one or more base-side metal layers is positioned outward of an outermost edge of the one or more cover-side metal layers;
• in the plan view, an innermost edge of the one or more cover-side metal layers is positioned inward of an innermost edge of the one or more base-side metal layers;
• the cover is bonded to the base by a bonding material provided on a region where the one or more base-side metal layers and the one or more cover-side metal layers overlap in the plan view;
• and
• a region of the one or more base-side metal layers that is positioned outward of the outermost edge of the one or more cover-side metal layers, and a region of the one or more cover-side metal layers that is positioned inward of the innermost edge of the one or more base-side metal layers absorb the bonding material that has run over the overlapping region of the one or more base-side metal layers and the one or more cover-side metal layers in the plan view.