Integrated circuit packages and methods

An integrated circuit package comprising:

• an integrated circuit die comprising:
• a substrate, wherein the substrate comprises a first semiconductor material;
• a protective structure in the substrate, wherein the protective structure comprises the first semiconductor material, wherein a first portion of the protective structure is doped with a first dopant and a second portion of the protective structure is doped with a second dopant, and wherein the first dopant and the second dopant are of different conductivity types;
• an interconnect structure on the substrate, wherein the interconnect structure comprises dielectric layers and conductive features in the dielectric layers;
• a seal ring structure in the dielectric layers of the interconnect structure, wherein the seal ring structure is in contact with the first portion of the protective structure;
• and
• a dielectric material on sidewalls of the integrated circuit die.

A method comprising:

• forming a protective structure in a substrate by sequentially doping the substrate with a first dopant and a second dopant, wherein the second dopant is different from the first dopant, and wherein the protective structure comprises a first portion comprising the first dopant and a second portion comprising the second dopant;
• forming an interconnect structure on a first portion of the substrate, wherein the interconnect structure comprises dielectric layers and conductive features in the dielectric layers;
• forming a seal ring structure in the dielectric layers of the interconnect structure, wherein the seal ring structure encircles the conductive features of the interconnect structure in a top-down view, wherein the seal ring structure is in contact with the second portion of the protective structure, and wherein the seal ring structure is separated from the first portion of the substrate by the second portion of the protective structure;
• singulating the substrate to form an integrated circuit die, wherein the integrated circuit die comprises the first portion of the substrate, the protective structure, the interconnect structure, and the seal ring structure;
• and
• forming an integrated circuit package with the integrated circuit die.