Electronic device including shielding structure for electronic component

An electronic device comprising:

• a printed circuit board;
• an electronic component coupled on the printed circuit board;
• a shield can on the printed circuit board surrounding the electronic component and including an opening facing the electronic component;
• a shielding structure on the shield can covering the opening;
• a heat conduction member between the electronic component and the shielding structure attached on the electronic component and contacting the shielding structure through the opening;
• a metal plate on the shielding structure;
• and
• at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conduction member,
• wherein the shielding structure includes:
• a first shielding member attached on the shield can,
• a first adhesive member interposed between the first shielding member and the shield can to attach the first shielding member to the shield can,
• a second shielding member attached on the first shielding member,
• a second adhesive member interposed between the first shielding member and the second shielding member to attach the second shielding member to the first shielding member,
• a protection member disposed on the second shielding member, and
• a groove dent toward the metal plate from the opening to accommodate the heat conduction member, and
• wherein a density of the first shielding member is smaller than a density of the second shielding member.