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US 2026/0101475 A1Published application
Enclosed Liquid Cooling System
AssigneeLiquacool IP LLC
InventorClas Sivertsen
Life of this patent
Estimating the term…
Abstract
A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.
Claims22
A liquid cooling system comprising:
- a printed circuit board;
- a gasket seated on a top side of the printed circuit board, the gasket encircling one or more components mounted on the printed circuit board;
- a silkscreened pattern printed on the printed circuit board for positioning the gasket;
- wherein the gasket is placed on the silkscreened pattern, with the silkscreened pattern used for positioning the gasket and the gasket is sealed against the silkscreened pattern;
- an enclosure seated on the gasket and fastened against the printed circuit board to form a sealed chamber with the printed circuit board and the gasket;
- a transfer liquid within the sealed chamber and contacting the one or more components mounted on the printed circuit board.
3 more elements
(canceled)
A method of using an enclosed liquid cooling system comprising:
- printing a silkscreened pattern on the printed circuit board;
- placing a gasket on a printed circuit board, encircling a portion of the printed circuit board wherein the gasket is placed on the silkscreened pattern, with the silkscreened pattern providing positioning and the gasket sealed against the silkscreened pattern for sealing for the gasket;
- seating an enclosure over the gasket and fastening the enclosure against the printed circuit board to form a chamber between the printed circuit board, the gasket and the enclosure forming a sealed chamber;
- and
- filling the chamber with a transfer liquid.
2 more elements
(canceled)
A liquid cooling system comprising:
- a substrate including a plurality of components and a silkscreened pattern printed on the substrate for the liquid cooling system;
- an enclosure placed on the silkscreened pattern on the substrate enclosing one or more of the plurality of components;
- a gasket positioned on the silkscreened pattern between the substrate and the enclosure, with the silkscreened pattern providing positioning and sealing with the gasket for the enclosure, the enclosure thereby forming a leakproof chamber filled with a transfer fluid to cool the one or more of the plurality of components within the enclosure.
Dependencies are inferred from the claim text.