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US 2026/0101438 A1Published application
Wiring board and manufacturing method for wiring board
AssigneeKYOCERA Corporation
InventorsTadashi NAGASAWA, Satoshi YOSHIURA, Takashi ISHIOKA
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Abstract
A wiring board includes an insulation substrate including a through hole, an electrical conductor layer located on at least a part of an inner wall surface of the through hole and a surface of the insulation substrate, and an organic resin layer covering the insulation substrate and the electrical conductor layer. The organic resin layer includes a filling portion located in the through hole.
Claims10
A wiring board comprising:
- an insulation substrate comprising a through hole;
- an electrical conductor layer located on at least a part of an inner wall surface of the through hole and a surface of the insulation substrate;
- and
- an organic resin layer covering the insulation substrate and the electrical conductor layer,
- wherein the organic resin layer comprises a filling portion located in the through hole.
2 more elements
A manufacturing method for a wiring board comprising:
- preparing an insulation substrate comprising a through hole;
- forming an electrical conductor layer on at least a part of an inner wall surface of the through hole and a surface of the insulation substrate;
- covering the insulation substrate and the electrical conductor layer with an organic resin film;
- performing heating and pressurizing treatment to fill the through hole with a part of the organic resin film;
- and
- curing the organic resin film to form an organic resin layer.
3 more elements
Dependencies are inferred from the claim text.